J-MEMS invites authors of the
IEEE MEMS 2014 Conference
to submit extended conference papers.
J-MEMS encourages manuscript submissions that are based upon papers presented at
technical conferences provided that the submitted paper has been enhanced significantly
when compared with any written version published in conference proceedings.
A newly submitted paper must contain 50% or greater new and substantive material, and it
must include the conference presentation as its first cited reference. Novelty is justified
best by new experimental results, enhanced modeling and characterization or further
system integration efforts. In order to aid the review process, authors submitting papers
based upon conference presentations must upload a copy of the conference paper as an
appendix to a newly submitted paper.
Full manuscripts should be submitted electronically through IEEE’s
Be sure to select “Enhanced Conference Presentation” as the Manuscript
Type, rather than “Original Paper.” This will ensure that your paper is
directed to the appropriate editors.
This Conference reflects from the rapid proliferation of the commitment and success of the Microsystems research community. In recent years, the IEEE MEMS Conference has attracted more than 700 participants, 800+ abstract submissions and has created the forum to present over 200 select papers in podium and poster/oral sessions. Its single-session format provides ample opportunity for interaction between attendees, presenters and exhibitors. MEMS 2012 will be held in Paris, FRANCE, from 29 January - 2 February 2012. The major areas of activity in the development of MEMS solicited and expected at this conference include but are not limited to:
Design, simulation and analysis tools with experimental verification
Fabrication technologies and processes
Silicon and non-silicon materials
Electro-mechanical integration techniques
Assembly and packaging approaches
Metrology and operational evaluation techniquesF
The major areas of activity in the application of MEMS solicited and expected at this conference include but are not limited to:
Mechanical, thermal, and magnetic sensors and actuators, and system
Opto-mechanical microdevices and microsystems
Fluidic microcomponents and microsystems
Microdevices for data storage
Microdevices for biomedical engineering
Micro chemical analysis systems
Microdevices and systems for wireless communication
Microdevices for power supply and energy harvesting
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