LPKF, a leading manufacturer of laser and electronic systems, announces that it has added another laser system to its repertoire. The MicroLine 1000 S presents a compact, cost-effective method for UV-laser depaneling of thin-rigid and rigid-flex assembled PCBs.

Dr. Ingo Bretthauer, CEO and Chairman of LPKF, commented, “The MicroLine 1000 S combines a low entry-level price with the highest cutting quality and superior process capabilities. Additionally, it is extremely flexible and, therefore, suited for high manufacturing variance. We are using a laser source that was optimized just for this application.”

With UV-laser cutting of assembled and/or unassembled PCBs, those with limited space will benefit. The UV laser beam can cut along delicate components or circuit paths without mechanical or thermal interference. The tool-less method makes any contour possible. Changes to the cutting paths are made by programming the software included with the machine or directly in the CAD software.